公开(公告)号：US11227834B2

公开(公告)日：2022-01-18

申请号：US16776255

申请日：2020-01-29

Applicant: Seagate Technology LLC

Inventor： Karthik Chandrasekar ,  Ratnakar Dadi ,  Shawn Tzung-Sheng Lo ,  Emmanuel Atta ,  Alexander Tain ,  Subodh Yashwant Bhike

IPC: H01L23/528 ,  G11B33/12 ,  H01L23/552 ,  G11B33/14 ,  H01L23/498

Abstract: A system including an analog block and a digital block. The analog block and the digital block are arranged on a package. The package includes a first ground coupled to the analog block and a second ground coupled to the digital block. The second ground is physically separate from the first ground. The package also includes a noise-mitigation stitching connector that has a first end connected to the first ground and a second end connected to the second ground.

公开(公告)号：US20210233845A1

公开(公告)日：2021-07-29

申请号：US16776255

申请日：2020-01-29

Applicant: Seagate Technology LLC

Inventor： Karthik Chandrasekar ,  Ratnakar Dadi ,  Shawn Tzung-Sheng Lo ,  Emmanuel Atta ,  Alexander Tain ,  Subodh Yashwant Bhike

IPC: H01L23/528 ,  H01L23/498 ,  G11B33/12 ,  H01L23/552 ,  G11B33/14

Abstract: A system including an analog block and a digital block. The analog block and the digital block are arranged on a package. The package includes a first ground coupled to the analog block and a second ground coupled to the digital block. The second ground is physically separate from the first ground. The package also includes a noise-mitigation stitching connector that has a first end connected to the first ground and a second end connected to the second ground.