Lapping Device or Carrier with Adaptive Bending Control
    1.
    发明申请
    Lapping Device or Carrier with Adaptive Bending Control 审中-公开
    具有自适应弯曲控制的研磨装置或载体

    公开(公告)号:US20150258655A1

    公开(公告)日:2015-09-17

    申请号:US14215921

    申请日:2014-03-17

    CPC classification number: B24B37/048 B24B37/30 G11B5/3169

    Abstract: An adaptive bending structure or insert for a lapping device is disclosed. In illustrated embodiments the bending structure provides a wider control width between bending nodes for imparting bending to a workpiece for lapping or longer beam length to increase stroke input at outer ends of the bending structure. In illustrated embodiments, outer bending fingers of the bending structure have a wider width than inner bending fingers to provide the wider control width of the adaptive bending structure. The wider bending fingers of the bending structure connect to actuator fingers of an actuator module to adapt the actuator module to provide an increased control width for controlling bow and curvature of the workpiece during the lapping process.

    Abstract translation: 公开了一种用于研磨装置的自适应弯曲结构或插入件。 在所示实施例中,弯曲结构在弯曲节点之间提供更宽的控制宽度,用于向工件施加弯曲以进行研磨或更长的梁长度以增加在弯曲结构的外端处的行程输入。 在所示实施例中,弯曲结构的外弯曲指状物具有比内弯曲指状物宽的宽度,以提供适应弯曲结构的更宽的控制宽度。 弯曲结构的较宽的弯曲指状物连接到致动器模块的致动器指状件,以使致动器模块适于提供增加的控制宽度,用于在研磨过程中控制工件的弓形和曲率。

Patent Agency Ranking