Computing system enclosure airflow management

    公开(公告)号:US09615485B1

    公开(公告)日:2017-04-04

    申请号:US14868902

    申请日:2015-09-29

    CPC classification number: H05K7/20145 H05K7/20209 H05K7/20727 H05K7/20836

    Abstract: The disclosed technology provides systems and methods for an enclosure system with optimized internal dynamically controllable airflow distribution. The systems include a computing system enclosure, and an electroactive film adhered to a surface of the computing system enclosure and configured to redirect airflow distribution in the computing system enclosure. In another implementation, a method monitoring airflow distribution within a computing system enclosure with a plurality of sensors, and controlling an orientation of a programmable microstructure in an electroactive film adhered to a surface of the computing system enclosure based on results of the monitoring operation. In yet another implementation, the disclosed technology includes bimetallic baffles configured for utilization in a computing system enclosure to redirect airflow distribution within the computing system enclosure.

    COMPUTING SYSTEM ENCLOSURE AIRFLOW MANAGEMENT

    公开(公告)号:US20170094833A1

    公开(公告)日:2017-03-30

    申请号:US14868902

    申请日:2015-09-29

    CPC classification number: H05K7/20145 H05K7/20209 H05K7/20727 H05K7/20836

    Abstract: The disclosed technology provides systems and methods for an enclosure system with optimized internal dynamically controllable airflow distribution. The systems include a computing system enclosure, and an electroactive film adhered to a surface of the computing system enclosure and configured to redirect airflow distribution in the computing system enclosure. In another implementation, a method monitoring airflow distribution within a computing system enclosure with a plurality of sensors, and controlling an orientation of a programmable microstructure in an electroactive film adhered to a surface of the computing system enclosure based on results of the monitoring operation. In yet another implementation, the disclosed technology includes bimetallic baffles configured for utilization in a computing system enclosure to redirect airflow distribution within the computing system enclosure.

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