公开(公告)号：US10183376B1

公开(公告)日：2019-01-22

申请号：US15298883

申请日：2016-10-20

Applicant: Seagate Technology LLC

Inventor： Yuhong Xiong ,  Joel W. Hoehn ,  Yeoh Hooi Sze ,  Ng Kok Cheong

IPC: B24B37/04 ,  G11B5/31

Abstract: Embodiments of the present disclosure include carriers for a row bar or stack of row bars to be lapped. In some embodiments, the ratio of the coefficient of thermal expansion of at least the bridge of a carrier to the coefficient of thermal expansion of the slider row bar or stack of slider row bars is less than 1.6. In some embodiments, a carrier can include a bridge having a length longer than the row bar or stack of row bars. In some embodiments, one or more bridge bending members can have junction centerlines offset from the corresponding bridge bending members.