Short on wafer laser for heat assisted magnetic recording

    公开(公告)号:US12170102B1

    公开(公告)日:2024-12-17

    申请号:US18375210

    申请日:2023-09-29

    Abstract: An apparatus includes a substrate. A laser is deposited above the substrate. The laser includes one or more non-self-supporting layers of crystalline material. The laser has a length along a light path in a range of about 40 um to about 350 um. An optical input coupler is configured to receive light from the laser. A waveguide is deposited proximate the optical input coupler. The waveguide is configured to communicate light from the laser via the optical input coupler to a near-field transducer that directs energy resulting from plasmonic excitation to a recording medium.

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