公开(公告)号：US20170164501A1

公开(公告)日：2017-06-08

申请号：US14957231

申请日：2015-12-02

Applicant: Seagate Technology LLC

Inventor： Odie Killen ,  Paul Foisy ,  Robert Walker ,  Alexander C. Worrall ,  David M. Davis

IPC: H05K7/14

CPC classification number: H05K7/1489 ,  G11B33/128 ,  H05K7/1492

Abstract: Method and apparatus for populating and operating a storage enclosure carrier with multiple hot swappable storage devices. In some embodiments, a carrier housing having length, width and thickness dimensions is adapted to accommodate at least one hard disc drive (HDD) having a selected HDD form factor and configured for engagement in a storage enclosure housing. A plurality of solid state drives (SSDs) each conforming to a selected SSD form factor are supported within the length, width and thickness dimensions of the carrier housing. Each of the SSDs is individually retractable from a front facing portion of the carrier housing without removal of the carrier housing from the storage enclosure housing.

公开(公告)号：US09826657B2

公开(公告)日：2017-11-21

申请号：US14957231

申请日：2015-12-02

Applicant: Seagate Technology LLC

Inventor： Odie Killen ,  Paul Foisy ,  Robert Walker ,  Alexander C. Worrall ,  David M. Davis

IPC: G06F1/16 ,  H05K5/00 ,  H05K7/00 ,  H05K7/14

CPC classification number: H05K7/1489 ,  G11B33/128 ,  H05K7/1492

Abstract: Method and apparatus for populating and operating a storage enclosure carrier with multiple hot swappable storage devices. In some embodiments, a carrier housing having length, width and thickness dimensions is adapted to accommodate at least one hard disc drive (HDD) having a selected HDD form factor and configured for engagement in a storage enclosure housing. A plurality of solid state drives (SSDs) each conforming to a selected SSD form factor are supported within the length, width and thickness dimensions of the carrier housing. Each of the SSDs is individually retractable from a front facing portion of the carrier housing without removal of the carrier housing from the storage enclosure housing.

公开(公告)号：US09274548B2

公开(公告)日：2016-03-01

申请号：US13782436

申请日：2013-03-01

Applicant: Seagate Technology LLC

Inventor： Paul Foisy ,  Robert I. Walker ,  Timothy P. E. Williams ,  Edward Janssen

IPC: G06F1/16 ,  H05K13/00 ,  H05K7/14

CPC classification number: G06F1/16 ,  H05K7/1445 ,  H05K7/1452 ,  Y10T29/49002

Abstract: The present disclosure relates to an electronic apparatus (100) comprising a backplane (120) and methods of assembling and disassembling such an apparatus. The electronic apparatus (100) comprises a chassis (101) having plural walls and a circuit board (140) fastened to a wall of the chassis, a surface of the circuit board having a plurality of conductive pads (146). A backplane (120) is fastened in a received position in the chassis substantially perpendicular to the circuit board. The backplane has a connector (130) at an edge of the backplane, the connector comprising a plurality of sprung conductive elements (132,134) which extend outwards beyond the edge of the backplane to make electrical contact with respective conductive pads (146) on the circuit board.

Abstract translation: 本公开涉及一种包括背板（120）的电子设备（100）以及组装和拆卸这种设备的方法。 电子设备（100）包括具有多个壁的底座（101）和紧固在底盘的壁上的电路板（140），电路板的表面具有多个导电垫（146）。 背板（120）被固定在底盘中基本垂直于电路板的接收位置。 背板在背板的边缘处具有连接器（130），连接器包括多个弹簧导电元件（132,134），其向外延伸超过背板的边缘以与电路上的相应导电焊盘（146）电接触 板。