公开(公告)号：US20150041429A1

公开(公告)日：2015-02-12

申请号：US14523117

申请日：2014-10-24

Applicant: Seagate Technology LLC

Inventor： Xilin Peng ,  Jiaoming Qiu ,  Yonghua Chen ,  Michael Christopher Kautzky ,  Mark Thomas Kief

IPC: G11B5/31

CPC classification number: G11B5/3116 ,  B82Y25/00 ,  G01R33/093 ,  G11B5/3163 ,  H01F41/30

Abstract: A tool for use in fabricating an electronic component includes a plurality of processing modules and a transfer chamber in communication with each of the plurality of processing modules. The transfer chamber includes a component for transferring a structure to each of the plurality of processing modules. The plurality of processing modules and the transfer chamber are sealed from the surrounding environment and are under a vacuum. The plurality of processing modules includes a first module configured to perform a first process on the structure and a second module configured to perform a second process on the structure. The first process includes performing at least one shaping operation on the structure.

Abstract translation: 用于制造电子部件的工具包括与多个处理模块中的每一个连通的多个处理模块和传送室。 传送室包括用于将结构传送到多个处理模块中的每一个的部件。 多个处理模块和传送室与周围环境密封并处于真空状态。 多个处理模块包括被配置为对该结构执行第一处理的第一模块和被配置为对该结构执行第二处理的第二模块。 第一过程包括在该结构上执行至少一个整形操作。