HEAT ASSISTED RECORDING MEDIA INCLUDING MUTLI-LAYER GRANULAR HEATSINK

    公开(公告)号:US20180218752A1

    公开(公告)日:2018-08-02

    申请号:US15422379

    申请日:2017-02-01

    CPC classification number: G11B5/7325 G11B5/66

    Abstract: Provided herein is a method including depositing an amorphous magnetic soft underlayer (SUL) over a substrate. A first portion of a heatsink layer is deposited over the SUL, wherein the first portion includes first heat conductive grains that are separated by first grain boundaries. A second portion of the heatsink layer is deposited over the first portion, wherein the second portion includes second heat conductive grains that are separated by second grain boundaries. The second grain boundaries are thicker than the first grain boundaries. A third portion of the heatsink layer is deposited over the second portion, wherein the third portion includes third heat conductive grains that are separated by third grain boundaries. The third grain boundaries are thicker than the second grain boundaries. A granular recording layer is deposited over the heatsink layer.

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