公开(公告)号：US20130141508A1

公开(公告)日：2013-06-06

申请号：US13680937

申请日：2012-11-19

Applicant: Seiko Instruments Inc.

Inventor： Noriyoshi SHOJI ,  Norimitsu SANBONGI ,  Keitaro KOROISHI ,  Toshimitsu MOROOKA ,  Takao AKIYAMA

IPC: B41J2/335

CPC classification number: B41J2/3359 ,  B41J2/33515 ,  B41J2/33585 ,  Y10T29/49083

Abstract: A method of manufacturing a thermal head, comprising the steps of: bonding a support substrate and an upper substrate, which have a flat shape, together in a laminated state, the support substrate and the upper substrate having opposed surfaces, at least one of which includes a heat-insulating concave portion; thinning the upper substrate bonded onto the support substrate in the bonding step; measuring a thickness of the upper substrate thinned in the thinning step; forming an identifying resistor having a resistance value varied in accordance with the thickness of the upper substrate measured in the measurement step, the identifying resistor including one end grounded; and forming a heating resistor on a surface of the upper substrate thinned in the thinning step at a position opposed to the heat-insulating concave portion.

Abstract translation: 一种制造热敏头的方法，包括以下步骤：将层叠状态下的具有平坦形状的支撑基板和上基板结合在一起，所述支撑基板和所述上基板具有相对的表面，其中至少一个 包括绝热凹部; 在接合步骤中，使粘合到支撑基板上的上基板变薄; 测量在稀疏步骤中变薄的上基板的厚度; 形成具有根据在所述测量步骤中测量的所述上基板的厚度而变化的电阻值的识别电阻器，所述识别电阻器包括一端接地; 以及在与所述绝热凹部相对的位置处在所述变薄步骤中变薄的所述上基板的表面上形成发热电阻体。