公开(公告)号：US10727170B2

公开(公告)日：2020-07-28

申请号：US14842571

申请日：2015-09-01

申请人： Semiconductor Components Industries, LLC

发明人： Swee Har Khor ,  Tian Hing Lim ,  Hui Min Ler ,  Chee Hiong Chew ,  Phillip Celaya

IPC分类号： H01L23/495 ,  H01L23/00 ,  H01L23/60 ,  H01L25/065 ,  H01L25/07 ,  H01L25/00 ,  H01L23/31 ,  H01L21/48

摘要： In one embodiment, methods for making semiconductor devices are disclosed.

公开(公告)号：US10700018B2

公开(公告)日：2020-06-30

申请号：US16181876

申请日：2018-11-06

申请人： SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

发明人： Erik Nino Tolentino ,  Chee Hiong Chew ,  Yusheng Lin ,  Swee Har Khor

IPC分类号： H01L23/00 ,  H01L23/495 ,  H01L21/78 ,  H01L21/48

摘要： Implementations of methods of forming a plurality of reinforced die may include forming a plurality of die on a substrate and patterning a metal gang frame to form a plurality of metal plates. The plurality of metal plates may correspond to the plurality of die. The method may include coupling the metal gang frame over the plurality of die and singulating the plurality of die. Each die of the plurality of die may include the corresponding metal plate from the plurality of metal plates coupled over the plurality of die.

公开(公告)号：US11348878B2

公开(公告)日：2022-05-31

申请号：US16886395

申请日：2020-05-28

申请人： SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

发明人： Erik Nino Tolentino ,  Chee Hiong Chew ,  Yusheng Lin ,  Swee Har Khor

IPC分类号： H01L23/00 ,  H01L23/495 ,  H01L21/78 ,  H01L21/48 ,  H01L23/373

摘要： Implementations of methods of forming a plurality of reinforced die may include forming a plurality of die on a substrate and patterning a metal gang frame to form a plurality of metal plates. The plurality of metal plates may correspond to the plurality of die. The method may include coupling the metal gang frame over the plurality of die and singulating the plurality of die. Each die of the plurality of die may include the corresponding metal plate from the plurality of metal plates coupled over the plurality of die.

公开(公告)号：US11791288B2

公开(公告)日：2023-10-17

申请号：US17660941

申请日：2022-04-27

申请人： SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

发明人： Chee Hiong Chew ,  Erik Nino Tolentino ,  Yusheng Lin ,  Swee Har Khor

IPC分类号： H01L23/00 ,  H01L23/495 ,  H01L21/78 ,  H01L21/48 ,  H01L23/373

CPC分类号： H01L23/562 ,  H01L21/4825 ,  H01L21/78 ,  H01L23/49513 ,  H01L23/49562 ,  H01L23/49582 ,  H01L23/3736 ,  H01L23/49579 ,  H01L24/03 ,  H01L24/45 ,  H01L2224/48227 ,  H01L2924/00

摘要： Implementations of methods of forming a plurality of reinforced die may include forming a plurality of die on a substrate and patterning a metal gang frame to form a plurality of metal plates. The plurality of metal plates may correspond to the plurality of die. The method may include coupling the metal gang frame over the plurality of die and singulating the plurality of die. Each die of the plurality of die may include the corresponding metal plate from the plurality of metal plates coupled over the plurality of die.

公开(公告)号：US11557530B2

公开(公告)日：2023-01-17

申请号：US16903706

申请日：2020-06-17

申请人： SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

发明人： Swee Har Khor ,  Tian Hing Lim ,  Hui Min Ler ,  Chee Hiong Chew ,  Phillip Celaya

IPC分类号： H01L23/495 ,  H01L23/00 ,  H01L25/065 ,  H01L25/07 ,  H01L25/00 ,  H01L23/60 ,  H01L21/48 ,  H01L23/31

摘要： In one embodiment, methods for making semiconductor devices are disclosed.