公开(公告)号：US20170365501A1

公开(公告)日：2017-12-21

申请号：US15619585

申请日：2017-06-12

Applicant: Semiconductor Technologies and Instruments Pte Ltd

Inventor： Lian Seng NG ,  Lian Aik TAN ,  Mun Fai LYE

IPC: H01L21/683 ,  G01L27/00 ,  G01L21/00

Abstract: A system is disclosed for calibrating the compressive forces exerted on a component during a component retrieval process from a carrier or support surface by a component handling device. The system includes a sensor, a component pickup assembly having a reference structure, a housing and a spring guide holder coupled to a suction tip. A resilient member may reside within the housing and the reference structure such that the spring guide holder and the housing are spaced from each other to define a variable first gap thereinbetween. A gate is formed by the reference structure and a sheath located on the housing whereby the reference structure is spaced from the housing to define a variable second gap thereinbetween. A detection structure is located within the variable second gap such that the sensor is able to detect portions of the detection structure. The detected portion of the detection structure or element at the second gap size is correlated to the height of the variable first gap and the height of the variable first gap is correlated to a reference predetermined threshold compressive force exerted on the component by the resilient member.