公开(公告)号：US20210109292A1

公开(公告)日：2021-04-15

申请号：US17065251

申请日：2020-10-07

Applicant: Senko Advanced Components, Inc.

Inventor： Kazuyoshi TAKANO ,  Gang XU ,  Tomoyuki MAMIYA

IPC: G02B6/36 ,  G02B6/04

Abstract: A fiber array device configured to secure and align one or more optical fiber bundles as part of a main body using a fixing material. The fixing material is light cured or room temperature cured. Main body forms an angle from a first direction along a second direction, and a recess the optical bundles are laid within and in which the fixing material is applied. Each individual optical fiber is laid within a groove formed in a lid, the base portion or both the lid and the base portion. The fiber array device is secured to a printed circuit board to form a communication path between the optical fiber and electronics of the board.