公开(公告)号：US20080217323A1

公开(公告)日：2008-09-11

申请号：US11930768

申请日：2007-10-31

申请人： Seung Jo Baek ,  Young Gjun Lee ,  Hyoung Jun Kim ,  Byeong Wook Park

发明人： Seung Jo Baek ,  Young Gjun Lee ,  Hyoung Jun Kim ,  Byeong Wook Park

IPC分类号： H05B3/02 ,  H05B3/10

CPC分类号： H05B3/08 ,  H05B3/0076 ,  H05B3/68 ,  H05B2203/016 ,  H05B2203/032

摘要： A heating device having an improved heat resistance structure is provided. The heating device may include a heating element that generates heat, and an elastic conductive part that applies electricity to the heating element. A connector may be provided between the elastic conductive part and the heating element to preclude direct contact between the heating element and the elastic conductive part. The heating element may be fixed to one side of the connector, and the elastic conductive part may be fixed to the other side of the connector to allow current applied from the elastic conductive part to flow to the heating element.

摘要翻译： 提供了具有改进的耐热结构的加热装置。 加热装置可以包括产生热量的加热元件和向加热元件施加电力的弹性导电部件。 可以在弹性导电部件和加热元件之间设置连接器，以防止加热元件和弹性导电部件之间的直接接触。 加热元件可以固定在连接器的一侧，并且弹性导电部分可以固定到连接器的另一侧，以允许从弹性导电部分施加的电流流到加热元件。