公开(公告)号：US06344632B1

公开(公告)日：2002-02-05

申请号：US08962451

申请日：1997-10-31

申请人： Seung-il Yu ,  Jung-kyu Lee

发明人： Seung-il Yu ,  Jung-kyu Lee

IPC分类号： H05B368

CPC分类号： H01L21/67109 ,  H01L21/67103

摘要： A round heating plate for a heating chamber used in semiconductor device manufacturing provides uniform heating of the wafer from its center to its outside edges. The round heating plate includes a small-diameter round heating element and multiple ring-shaped elements arranged concentrically therewith. The round heating plate has the same shape as the wafer, and in the heating chamber, a pair of round heating plates is arranged so as to be concentric with a pair of wafers to be heated. During heating, the wafers are installed in a space formed between the heating plates.

摘要翻译： 在半导体器件制造中使用的用于加热室的圆形加热板使得晶片从其中心到其外部边缘均匀加热。 圆形加热板包括小直径圆形加热元件和与其同心布置的多个环形元件。 圆形加热板具有与晶片相同的形状，并且在加热室中，一对圆形加热板被布置成与要加热的一对晶片同心。 在加热期间，将晶片安装在形成在加热板之间的空间中。