公开(公告)号：US20250046699A1

公开(公告)日：2025-02-06

申请号：US18491406

申请日：2023-10-20

Applicant: Shanghai AVIC OPTO Electronics Co., Ltd.

Inventor： Huijun JIN ,  Zhen LIU ,  Mingyu WANG

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/00

Abstract: Functional component, forming method thereof and electronic device are provided. The functional component includes a packaging substrate and a connecting wire. The packaging substrate includes a through-hole wire-bonding area including a first insulating layer and a wire-bonding electrode sequentially formed on the substrate. The first insulating layer includes a first through hole, and the wire-bonding electrode covers the first through hole. In an area corresponding to the first through hole, the packaging substrate has wire-bonding bump electrodes on a side of the wire-bonding electrode away from the first insulating layer. The connecting wire includes a wire-bonding connection portion and a wire-bonding extension portion connected to the wire-bonding connection portion. The wire-bonding connection portion is fixedly connected to the wire-bonding electrode. The wire-bonding connection portion extends to cover at least a partial area of a side of at least one of the wire-bonding bump electrodes.