摘要:
A first electrode disposed on a first surface of the solar cell. A second electrode disposed on a second surface of the solar cell. A connection member electrically couples the first electrode with an electrode of a solar cell connectable to the solar cell. The first electrode includes multiple fine line-shaped electrodes and a first connection electrode configured to connect electrically with the multiple fine line-shaped electrodes. A width of the first connection electrode is smaller than that of the connection member, and the second electrode comprises an electricity collecting electrode and a second connection electrode configured to connect electrically with the electricity collecting electrode. A width of the second connection electrode is the same as or larger than a region width of the first connection electrode.
摘要:
In the solar cell module including a plurality of solar cells interconnected with wiring members, each of the solar cells includes a plurality of front-side finger electrodes that are disposed on a light-receiving surface of the solar cell and connected with tabs and a plurality of rear-side finger electrodes that are disposed on a rear surface of the solar cell and connected with tabs. Rear-side auxiliary electrode sections are arranged in regions, which is wider than the front-side finger electrodes, on the rear surface opposite to regions where the front-side finger electrodes are present.
摘要:
A method and apparatus for breaking a semiconductor substrate along a predetermined area over which a split groove is formed. The breaking apparatus includes a table for placing a portion of the semiconductor substrate inside the predetermined area and a breaking blade being operable to move downward from a position above the semiconductor substrate placed on the table to thereby compress a portion of the semiconductor substrate outside the predetermined area so that the semiconductor substrate is broken along the split groove. The predetermined area of the semiconductor substrate has at least a neighboring pair of sides intersecting at an angle of less than 180 degrees, and the breaking blade has a projection which, when the semiconductor substrate is broken, compresses a portion of the semiconductor substrate outside the one side so that the one side is compressed ahead of the other side.