公开(公告)号：US06646455B2

公开(公告)日：2003-11-11

申请号：US09121870

申请日：1998-07-24

申请人： Shigeki Maekawa ,  Megumi Takemoto ,  Kazunobu Miki ,  Mutsumi Kano ,  Takahiro Nagata ,  Yoshihiro Kashiba

发明人： Shigeki Maekawa ,  Megumi Takemoto ,  Kazunobu Miki ,  Mutsumi Kano ,  Takahiro Nagata ,  Yoshihiro Kashiba

IPC分类号： B08B100

CPC分类号： G01R1/06738 ,  G01R1/06755 ,  G01R3/00

摘要： A test probe for semiconductor devices, the test probe having a tip portion which is pressed against a test pad of a semiconductor device to establish electrical contact between the tip portion and the pad for testing the operation of the semiconductor device, wherein the probe is formed to have a tip shape with an angle of not less than 15 degrees formed at the surface of the pad between a tangential line with respect to a tip face of the probe and the pad surface when the probe is pressed against the pad, the tip shape of the probe having a spherical surface meeting the relationship of: &thgr;=cos−1(1−t/R)≧15° where the radius of curvature of the spherical surface is R, the thickness of the pad is t, and the angle formed at the pad surface between the tangential line with respect to the probe tip face and the pad surface when the probe is pressed against the pad is &thgr;, the probe have a flat portion at an end of the tip portion. Accordingly, a contact surface can be established between the probe trip and the pad with a sufficient degree of electrical continuity, and when the the probe level is adjusted in the probing, a time required for positioning the probe prior to the start of measurement is cut down and variation in measurement are reduced.

摘要翻译： 一种用于半导体器件的测试探针，所述测试探针具有被压靠在半导体器件的测试焊盘上的尖端部分，以建立所述尖端部分和所述焊盘之间的电接触，以测试所述半导体器件的操作，其中形成所述探针 在探针被压靠在衬垫上时，具有相对于探针的尖端面的切线与衬垫表面之间形成有不小于15度的角度的尖端形状， 所述探针具有满足以下关系的球面的球面：其中球面的曲率半径为R，垫的厚度为t，并且在相对于探针尖端的切线之间形成在垫表面处的角度 当探针被压靠在垫上时，表面和垫表面是θ，探针在尖端部分的端部具有平坦部分。 因此，可以在探针跳闸和焊盘之间建立足够的电连续性的接触表面，并且当在探测中调整探针电平时，切割在测量开始之前定位探针所需的时间被切断 降低了测量的变化。

公开(公告)号：US06888344B2

公开(公告)日：2005-05-03

申请号：US10285625

申请日：2002-11-01

申请人： Shigeki Maekawa ,  Megumi Takemoto ,  Kazunobu Miki ,  Mutsumi Kano ,  Takahiro Nagata ,  Yoshihiro Kashiba

发明人： Shigeki Maekawa ,  Megumi Takemoto ,  Kazunobu Miki ,  Mutsumi Kano ,  Takahiro Nagata ,  Yoshihiro Kashiba

IPC分类号： G01R1/067 ,  G01R3/00 ,  G01R1/04

CPC分类号： G01R1/06738 ,  G01R1/06755 ,  G01R3/00

摘要： A test probe for semiconductor devices, the test probe having a tip portion which is pressed against a test pad of a semiconductor device to establish electrical contact between the tip portion and the pad for testing the operation of the semiconductor device, wherein the probe is formed to have a tip shape with an angle of not less than 15 degrees formed at the surface of the pad between a tangential line with respect to a tip face of the probe and the pad surface when the probe is pressed against the pad, the tip shape of the probe having a spherical surface meeting the relationship of: θ=cos−1(1−t/R)≧15° where the radius of curvature of the spherical surface is R, the thickness of the pad is t, and the angle formed at the pad surface between the tangential line with respect to the probe tip face and the pad surface when the probe is pressed against the pad is θ, the probe have a flat portion at an end of the tip portion. Accordingly, a contact surface can be established between the probe trip and the pad with a sufficient degree of electrical continuity, and when the the probe level is adjusted in the probing, a time required for positioning the probe prior to the start of measurement is cut down and variation in measurement are reduced.

摘要翻译： 一种用于半导体器件的测试探针，所述测试探针具有被压靠在半导体器件的测试焊盘上的尖端部分，以建立所述尖端部分和所述焊盘之间的电接触，以测试所述半导体器件的操作，其中形成所述探针 在探针被压靠在衬垫上时，具有相对于探针的尖端面的切线与衬垫表面之间形成有不小于15度的角度的尖端形状， 具有满足以下关系的球面的探针：<？in-line-formula description =“In-line Formulas”end =“lead”？> theta = cos（1-t） / R）> = 15°<？in-line-formula description =“在线公式”end =“tail”？>其中球面的曲率半径为R，垫的厚度为t， 当探针被按压时，形成在相对于探针尖端面的切线与焊盘表面之间的焊盘表面处的角度 衬垫是θ，探针在尖端部分的端部具有平坦部分。 因此，可以在探针跳闸和焊盘之间建立足够的电连续性的接触表面，并且当在探测中调整探针电平时，切割在测量开始之前定位探针所需的时间被切断 降低了测量的变化。