公开(公告)号：US5223855A

公开(公告)日：1993-06-29

申请号：US486438

申请日：1990-02-28

申请人： Shigenori Ota ,  Tsuyoshi Yasutomi ,  Kenji Nakai ,  Masayuki Nomoto

发明人： Shigenori Ota ,  Tsuyoshi Yasutomi ,  Kenji Nakai ,  Masayuki Nomoto

IPC分类号： B41J2/335

CPC分类号： B41J2/3352 ,  B41J2/3355 ,  B41J2/3357 ,  B41J2/33575

摘要： The invention provide a thermal head wherein a head substrate composed by disposing plural heating resistance elements on a support board, and a flexible wiring substrate for connecting the heating resistance elements and an external circuit are adhered together by using a soft adhesive with the shear adhesion strength of 25 kg/cm.sup.2 or less.According to the invention, without having to dispose a reinforcing plate for reinforcing the flexible wiring substrate, the flexible wiring substrate and the head substrate are adhered directly with soft adhesive, and therefore when printing, especially when printing continuously, if the temperature of the head substrate and flexible wiring substrate is raised, the difference in the thermal expansion of the two is absorbed sufficiently by the elasticity of the elastic wiring substrate, and the difference in the thermal expansion between the head substrate and flexible wiring substrate and support board is absorbed by the soft adhesive, and hence the deformation of the thermal head may be eliminated completely, and the transmission of electric signal from external circuit to the integrated circuit is made accurate, so that printing may be done in normal state.

摘要翻译： 本发明提供一种热敏头，其中通过在支撑板上设置多个加热电阻元件而构成的头基板和用于连接加热电阻元件和外部电路的柔性布线基板通过使用具有剪切粘合强度的软粘合剂 为25kg / cm 2以下。 根据本发明，不需要设置用于加强柔性布线基板的加强板，柔性布线基板和头基板直接用软粘合剂粘合，因此特别是当连续印刷时，如果头部的温度 基板和柔性布线基板升高，两者的热膨胀差由于弹性布线基板的弹性而被充分吸收，并且头基板和柔性布线基板和支撑板之间的热膨胀差被 柔软的粘合剂，因此可以完全消除热敏头的变形，并且将电信号从外部电路传输到集成电路是准确的，使得可以在正常状态下进行打印。