公开(公告)号：US20110225818A1

公开(公告)日：2011-09-22

申请号：US12727613

申请日：2010-03-19

申请人： Shih-Bin Chiu ,  Yan-Hua Chen ,  Yi-Ching Chuang

发明人： Shih-Bin Chiu ,  Yan-Hua Chen ,  Yi-Ching Chuang

IPC分类号： H05K3/30

CPC分类号： H05K1/0203 ,  H05K1/0272 ,  H05K3/0058 ,  H05K2201/066 ,  H05K2201/10106 ,  H05K2201/10409 ,  Y10T29/4913

摘要： A method of manufacturing an LED illuminator is provided. At least one flat heat pipe (FHP) is provided, on which a flat surface is formed. A treating tool is provided to fix the FHP. A printed circuit layer is formed on the flat surface, which includes an insulated layer, a conductive layer and a solder mask layer spread on the flat heat pipe in order, to form solder portions. After that, solder paste is applied on the solder portions, and LED elements are disposed on the solder portions correspondingly. Finally, the FHP and the LED elements are passed through a reflow oven, to accomplish an LED illuminator. The FHP further has locating holes, which are used for orientating the FHP and connecting a heat-dissipating module by a concise assembling element.

摘要翻译： 提供一种制造LED照明器的方法。 提供至少一个扁平热管（FHP），在其上形成平坦表面。 提供一种治疗工具来固定FHP。 在平坦的表面上形成印刷电路层，其中包括在平坦的热管上铺展的绝缘层，导电层和焊料掩模层，以形成焊料部分。 之后，将焊膏施加到焊料部分上，并且相应地将LED元件设置在焊料部分上。 最后，FHP和LED元件通过回流炉，实现LED照明。 FHP还具有定位孔，用于定向FHP并通过简明的组装元件连接散热模块。