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公开(公告)号:US20060291674A1
公开(公告)日:2006-12-28
申请号:US11151460
申请日:2005-06-14
IPC分类号: H04R25/00
CPC分类号: H04R19/04
摘要: A method of making a silicon-based miniaturized microphone by means of the application of a combination of processes including a semiconductor manufacturing process and a silicon micro-machining technology. A silicon-based miniaturized microphone made by means of this method has a silicon substrate, which defines a resonance cavity, a diaphragm, a backplate having sound holes, and solder pads. This method is easy to perform, and suitable for a mass production to reduce the manufacturing cost.
摘要翻译: 一种通过应用包括半导体制造工艺和硅微加工技术在内的工艺的组合来制造硅基小型化麦克风的方法。 通过该方法制造的基于硅的小型化麦克风具有限定谐振腔的硅衬底,隔膜,具有声孔的背板和焊盘。 该方法易于执行,适合批量生产,降低制造成本。