公开(公告)号：US20120152749A1

公开(公告)日：2012-06-21

申请号：US13311020

申请日：2011-12-05

申请人： Shingo YASUDA ,  Fumio Kuriyama ,  Masashi Shimoyama ,  Mizuki Nagai ,  Yusuke Tamari

发明人： Shingo YASUDA ,  Fumio Kuriyama ,  Masashi Shimoyama ,  Mizuki Nagai ,  Yusuke Tamari

IPC分类号： C25D5/02 ,  C25D5/00

CPC分类号： C25D5/18 ,  C25D7/123

摘要： An electroplating method can securely and efficiently fill a plated metal into deep high-aspect ratio vias in a bottom-up manner without producing defects in the plated metal. The electroplating method includes: immersing a substrate, having vias formed in a surface, and an anode in a plating solution in a plating tank, the anode being disposed opposite the surface of the substrate; and intermittently passing a plating current at a constant current value between the substrate and the anode in such a manner that the supply and the stop of the plating current are repeated, and that the proportion of a current supply time during which the plating current is supplied increases with the progress of plating, thereby filling a plated metal into the vias.

摘要翻译： 电镀方法可以以自下而上的方式可靠且有效地将电镀金属填充到深高纵横比的通孔中，而不会在电镀金属中产生缺陷。 电镀方法包括：在基板的表面上设置阳极，将具有在表面中形成的通孔的基板和阳极浸入电镀槽中的电镀液中; 并以这样的方式间歇地通过基板和阳极之间的恒定电流值的电镀电流，使得电镀电流的供应和停止重复，并且提供电镀电流的电流供应时间的比例 随着电镀的进行而增加，从而将电镀金属填充到通孔中。