SILPHENYLENE-CONTAINING PHOTOCURABLE COMPOSITION, PATTERN FORMATION METHOD USING SAME, AND OPTICAL SEMICONDUCTOR ELEMENT OBTAINED USING THE METHOD
    1.
    发明申请
    SILPHENYLENE-CONTAINING PHOTOCURABLE COMPOSITION, PATTERN FORMATION METHOD USING SAME, AND OPTICAL SEMICONDUCTOR ELEMENT OBTAINED USING THE METHOD 审中-公开
    含有苯甲烯的光致抗蚀剂组合物,使用其的图案形成方法和使用该方法获得的光学半导体元件

    公开(公告)号:US20110311788A1

    公开(公告)日:2011-12-22

    申请号:US13163174

    申请日:2011-06-17

    IPC分类号: B32B3/10 G03F7/30 G03F7/004

    摘要: Provided is a silphenylene-containing photocurable composition including: (A) a specific silphenylene having both terminals modified with alicyclic epoxy groups, and (C) a photoacid generator that generates acid upon irradiation with light having a wavelength of 240 to 500 nm. Also provided is a pattern formation method including: (i) forming a film of the photocurable composition on a substrate, (ii) exposing the film through a photomask with light having a wavelength of 240 to 500 nm, and if necessary, performing heating following the exposure, and (iii) developing the film in a developing liquid, and if necessary, performing post-curing at a temperature within a range from 120 to 300° C. following the developing. Further provided is an optical semiconductor element obtained by performing pattern formation using the method. The composition is capable of very fine pattern formation across a broad range of wavelengths, and following pattern formation, yields a film that exhibits a high degree of transparency and superior light resistance. The composition may also include: (B) a specific epoxy group-containing organosilicon compound.

    摘要翻译: 本发明提供一种含有亚苯基苯的光固化性组合物,其含有:(A)具有两个末端被脂环族环氧基改性的特定的硅亚苯基,(C)光照酸产生剂,其在波长240〜500nm的光照射下产生酸。 还提供了一种图案形成方法,包括:(i)在基板上形成光固化性组合物的膜,(ii)用波长为240〜500nm的光使膜通过光掩模曝光,如果需要,进行加热 曝光,和(iii)在显影液中显影该膜,如有必要,在显影后在120-300℃的温度下进行后固化。 还提供了通过使用该方法进行图案形成而获得的光学半导体元件。 组合物能够在宽波长范围内形成非常精细的图案,并且在图案形成之后,产生显示出高透明度和优异耐光性的膜。 组合物还可以包括:(B)特定的含环氧基的有机硅化合物。

    Silphenylene skeleton-containing silicone type polymer and method for manufacturing the same
    3.
    发明授权
    Silphenylene skeleton-containing silicone type polymer and method for manufacturing the same 有权
    含硅亚苯基骨架的硅氧烷型聚合物及其制造方法

    公开(公告)号:US08476379B2

    公开(公告)日:2013-07-02

    申请号:US13095237

    申请日:2011-04-27

    IPC分类号: C08F283/12 C08G67/02

    摘要: There is disclosed a silphenylene skeleton-containing silicone type polymer comprising a repeating unit represented by the following general formula (1) and having a weight average molecular weight of 5,000 to 40,000. There can be a novel silphenylene skeleton-containing silicone type polymer which enables to satisfy both chemical resistance and adhesiveness to a substrate and can be used as a material for a thermosetting resin for forming coatings for protecting substrates, circuits, and interconnections; and a method for manufacturing the same.

    摘要翻译: 公开了包含由以下通式(1)表示的重均单元,重均分子量为5,000〜40,000的含硅亚
    苯基骨架的硅氧烷型聚合物。 可以存在能够满足对基板的耐化学性和粘合性的新型含硅亚苯基骨架的硅氧烷型聚合物,并且可以用作形成用于保护基板,电路和互连的涂层的热固性树脂的材料; 及其制造方法。

    Oil compound and defoamer composition
    4.
    发明授权
    Oil compound and defoamer composition 有权
    油化合物和消泡剂组成

    公开(公告)号:US09278298B2

    公开(公告)日:2016-03-08

    申请号:US13433346

    申请日:2012-03-29

    摘要: An oil compound used for defoaming includes (A) a substantially hydrophobic organopolysiloxane having a viscosity of 10 to 100,000 mm2/second at 25° C., and (B) finely divided silica that has undergone surface hydrophobization treatment, wherein when an insoluble matter is collected from the oil compound by using hexane and the spectra of the insoluble matter are measured by 29Si-CP/MAS-NMR, the peaks of the silica due to the SiO4/2 (Q) units on the silica surface are such that a ratio [(Q2+Q3)/Q4] between a total area (Q2+Q3) wherein Q2 is a peak area of a silicon atom having two unreacted silanol groups and Q3 is a peak area of a silicon atom having one unreacted silanol group and an area Q4 wherein Q4 is a peak area of a silicon atom having no unreacted silanol group is at 70/30 to 20/80.

    摘要翻译: 用于消泡的油性化合物包括(A)在25℃下粘度为10〜100,000mm 2 /秒的基本上疏水的有机聚硅氧烷,(B)经过表面疏水化处理的细碎二氧化硅,其中当不溶物为 通过使用己烷从油性化合物中收集,不溶物质的光谱通过29Si-CP / MAS-NMR测定,由二氧化硅表面上的SiO 4/2(Q)单元引起的二氧化硅的峰值使得比例 其中Q2是具有两个未反应的硅烷醇基团的硅原子的峰面积和Q3是具有一个未反应的硅烷醇基团的硅原子的峰面积的总面积(Q2 + Q3)之间的[(Q2 + Q3)/ Q4] Q4其中,Q4是没有未反应的硅烷醇基的硅原子的峰面积为70/30〜20/80。