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公开(公告)号:US20230330858A1
公开(公告)日:2023-10-19
申请号:US18044242
申请日:2021-09-09
申请人: Siemens Corporation
IPC分类号: B25J9/16
CPC分类号: B25J9/1687 , B25J9/1697 , B25J5/007
摘要: In an example aspect, a first object (e.g., an electronic component) is inserted by a robot into a second object (e.g., a PCB). An autonomous system can capture a first image of the first object within a physical environment. The first object can define a mounting interface configured to insert into the second object. Based on the first image, a robot can grasp the first object within the physical environment. While the robot grasps the first object, the system can capture a second image of the first object. The second image can include the mounting interface of the first object. Based on the second image of the first object, the system can determine a grasp offset associated with the first object. The grasp offset can indicate movement associated with the robot grasping the first object within the physical environment. The system can also capture an image of the second object. Based on the grasp offset and the image of the second object, the robot can insert the first object into the second object.