公开(公告)号：US10978365B2

公开(公告)日：2021-04-13

申请号：US16820464

申请日：2020-03-16

Applicant: Sirrus, Inc.

Inventor： Bernard Miles Malofsky ,  Adam Gregg Malofsky ,  Matthew Mcbrayer Ellison

IPC: H01L23/29 ,  H01L21/56 ,  H01L23/498 ,  H01L23/00

Abstract: An electronics composition includes a curable matrix material and, optionally, a filler material disposed within the matrix material. The cured matrix material includes an oligomer or polymer material derived from a compound selected from a methylene malonate monomer, a multifunctional methylene monomer, a methylene beta ketoester monomer, a methylene beta diketone monomer, or a mixture thereof.