公开(公告)号：US20190115285A1

公开(公告)日：2019-04-18

申请号：US16161318

申请日：2018-10-16

Applicant: Sitronix Technology Corp

Inventor： Kuo-Wei Tseng ,  Po-Chi Chen ,  Jui-Hsuan Cheng

IPC: H01L23/495 ,  H01L23/00

Abstract: The present invention discloses a lead structure of the circuit, which comprises a first lead and a second lead. The first lead includes a first bump connecting part and a first lead segment. The first lead segment is connected to the first bump connecting part. The width of the first lead segment is smaller than the width of the first bump connecting part. The second lead is adjacent to the first lead and there is a lead gap therebetween. The second lead also includes a second bump connecting part and a first lead segment. The first lead segment of the second lead is connected to the second bump connecting part. The second bump connecting part and the first bump connecting part are arranged staggeredly. The second bump connecting part is adjacent to the first lead segment of the first lead.

公开(公告)号：US11217508B2

公开(公告)日：2022-01-04

申请号：US16161318

申请日：2018-10-16

Applicant: Sitronix Technology Corp

Inventor： Kuo-Wei Tseng ,  Po-Chi Chen ,  Jui-Hsuan Cheng

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/498 ,  H01L23/60

Abstract: The present invention discloses a lead structure of the circuit, which comprises a first lead and a second lead. The first lead includes a first bump connecting part and a first lead segment. The first lead segment is connected to the first bump connecting part. The width of the first lead segment is smaller than the width of the first bump connecting part. The second lead is adjacent to the first lead and there is a lead gap therebetween. The second lead also includes a second bump connecting part and a first lead segment. The first lead segment of the second lead is connected to the second bump connecting part. The second bump connecting part and the first bump connecting part are arranged staggeredly. The second bump connecting part is adjacent to the first lead segment of the first lead.