公开(公告)号：US20210278293A1

公开(公告)日：2021-09-09

申请号：US17256534

申请日：2019-06-28

Applicant: Sony Corporation

Inventor： Keisuke KINOKUNI ,  Makoto YAMAGUCHI ,  Hiroaki YAMANA ,  Masakazu KOBAYASHI ,  Ryo SHIRAIWA

IPC: G01L1/14 ,  G06F3/044 ,  G06F3/041

Abstract: A sensor includes a base material, a first elastic layer provided on the base material, and a sensor body which is provided on the first elastic layer and includes an electrostatic capacitive sensing part, and the base material and the first elastic layer are bonded such that an area corresponding to the sensing part becomes a non-bonded area.

公开(公告)号：US20200159359A1

公开(公告)日：2020-05-21

申请号：US16632751

申请日：2018-07-20

Applicant: Sony Corporation

Inventor： Tomoki KAWABATA ,  Yasushi ITOSHIRO ,  Toshiaki NISHIKAWA ,  Munetake EBIHARA ,  Akira FUJISAWA ,  Kei TSUKAMOTO ,  Hiroaki YAMANA ,  Makoto YAMAGUCHI ,  Keisuke KINOKUNI

IPC: G06F3/041 ,  H04M1/02 ,  G06F1/16 ,  G06F11/30 ,  H01H13/02 ,  G01L5/00

Abstract: An electronic device includes: a housing; a sensor provided on an inner surface of the housing and configured to detect deformation of the housing; and a control unit configured to control an operation of the electronic device on the basis of a detection result of the sensor. The sensor has a first sensing unit configured to detect a prescribed user operation and a second sensing unit configured to compensate for a malfunction.