公开(公告)号：US20140042578A1

公开(公告)日：2014-02-13

申请号：US14032366

申请日：2013-09-20

Applicant: Sony Corporation

Inventor： Yuichi Takagi ,  Masayoshi Kanazawa ,  Kazuhiko Ueda ,  Makoto Tsuchimochi ,  Shigeo Ikeda

IPC: H01L27/146

CPC classification number: H01L27/14601 ,  H01L25/16 ,  H01L27/14618 ,  H01L27/14623 ,  H01L27/14627 ,  H01L27/14683 ,  H01L31/0203 ,  H01L31/02325 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/3025 ,  H04N5/2253 ,  H04N5/2257 ,  H05K1/0284 ,  H05K1/0306 ,  H05K1/144 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A solid-state imaging device and one or more bare ICs disposed on a back face of a solid-state imaging apparatus. The bare ICs are sealed by a resin. A circuit board may be interposed between the solid-state imaging device and the bare ICs, or the solid-state imaging device and the ICs are directly bonded together. The IC chips may be disposed on the inner surface, mainly the ceiling surface, of a light-shielding case. The imaging apparatus may be within a package with a pinhole.

Abstract translation: 固态成像装置和设置在固态成像装置的背面上的一个或多个裸IC。 裸IC被树脂密封。 可以在固态成像装置和裸IC之间插入电路板，或者将固态成像装置和IC直接接合在一起。 IC芯片可以设置在遮光壳体的内表面，主要是天花板表面上。 成像装置可以在具有针孔的包装内。