公开(公告)号：US06190604B1

公开(公告)日：2001-02-20

申请号：US09300122

申请日：1999-04-26

申请人： Soon Hyung Hong ,  Hyo Soo Lee ,  Kyung Yoon Jeon

发明人： Soon Hyung Hong ,  Hyo Soo Lee ,  Kyung Yoon Jeon

IPC分类号： B28B302

CPC分类号： C04B41/009 ,  B22F2998/10 ,  B28B7/46 ,  C04B35/565 ,  C04B41/5155 ,  C22C1/1036 ,  C22C2001/1021 ,  C04B41/4521 ,  C04B41/4523 ,  B22F1/0014 ,  B22F9/04 ,  B22F3/22

摘要： The present invention relates to a method of preparing a preform with a high volume fraction of SiC particles. A slurry containing SiC particles and binders is ball-milled and pressed in an apparatus to give a primary preform. This primary preform is dried at room temperature and then, at a high temperature. The dried primary preform is subjected to calcination to prepare the preform. In the apparatus, which comprises a bottom die; a top mold with a cavity, placed on the bottom die, an upper punch for pressing a material for the preform in the cavity; and two water-absorbers, one being inserted between the bottom die and the top mold, the other being placed on the top mold, the slurry is introduced in the cavity and pressed by the punch while the water is absorbed in the absorbers or drained through a gap between the bottom die and the top mold, thereby improving the volume fraction of SiC particles. The preform can be used as a fundamental material in producing metal matrix composites having a high thermal conductivity and a low coefficient of thermal expansion, suitable for the application for, e.g., electronic packaging and space-air structures.

摘要翻译： 本发明涉及一种制备具有高体积分数的SiC颗粒的预成型体的方法。 将含有SiC颗粒和粘合剂的浆料球磨并在设备中压制以得到初级预制件。 该初级预制件在室温下干燥，然后在高温下干燥。 将干燥的初级预制件进行煅烧以制备预制件。 在包括底模的装置中; 放置在底模上的具有空腔的顶模，用于在空腔中挤压预制件的材料的上冲头; 和两个吸水器，一个插入在底模和顶模之间，另一个放置在顶模上，将浆料引入空腔中并由冲头压制，同时水被吸收在吸收器中或排出通过 底模和顶模之间的间隙，从而提高SiC颗粒的体积分数。 该预型件可用作生产具有高热导率和低热膨胀系数的金属基复合材料的基本材料，适用于例如电子封装和空间 - 空气结构。

公开(公告)号：US06491862B1

公开(公告)日：2002-12-10

申请号：US09688829

申请日：2000-10-17

申请人： Soon Hyung Hong ,  Hyo Soo Lee ,  Kyung Yoon Jeon

发明人： Soon Hyung Hong ,  Hyo Soo Lee ,  Kyung Yoon Jeon

IPC分类号： B28B302

CPC分类号： C04B35/565

摘要： Disclosed is a method for producing an SiC preform of a high volume fraction used for the manufacture of a metal matrix composite. The method involves the steps of mixing SiC particles of different particle sizes each selected from a range of 0.2 to 48 &mgr;m with an organic binder, an inorganic binder, an aggregating agent, and distilled water, thereby producing a mixture, and stirring the mixture in accordance with a ball milling process, thereby producing a slurry containing the SiC particles, pouring the slurry containing the SiC particles into a mold having upper and lower molds respectively provided with absorbent bodies, and squeezing the slurry in the mold, thereby reducing a residual moisture content of the slurry, completely drying the slurry reduced in residual moisture content, thereby producing an SiC preform, and calcinating the SiC preform. The preform is impregnated with a metal matrix while maintaining a high reinforcement volume fraction of 70 vol % or more. Accordingly, this preform can be widely used for fundamental materials of metal matrix composites used to manufacture electronic packaging components and aerospace components requiring a low thermal expansion coefficient and a high thermal conductivity.

摘要翻译： 公开了一种用于制造用于制造金属基质复合材料的高体积分数的SiC预制件的方法。 该方法包括将0.2〜48μm的范围的不同粒径的SiC颗粒与有机粘合剂，无机粘合剂，聚集剂和蒸馏水混合的步骤，从而制备混合物 根据球磨工艺，由此制备含有SiC颗粒的浆料，将含有SiC颗粒的浆料倒入具有分别设置有吸收体的上模和下模的模具中，并将浆料挤压到模具中，从而减少残留水分 浆料的含量，完全干燥浆料减少了残留水分含量，由此制备了SiC预制件，并煅烧了SiC预制件。 预成型体用金属基体浸渍，同时保持70体积％以上的高增强体积分数。 因此，该预型件可广泛用于制造电子封装部件和需要低热膨胀系数和高导热性的航空航天部件的金属基复合材料的基础材料。