专利检索 ap:("Soon Kang HUANG" OR "Kun-Ku HUNG" OR "Zin-Chang WEI" OR "Chyi Shyuan CHERN") AND inv:"Kun-Ku HUNG" 第 1 页

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发明申请
SYSTEM AND METHOD FOR CONDITIONING CHEMICAL MECHANICAL POLISHING APPARATUS USING MULTIPLE CONDITIONING DISKS 审中-公开
标题翻译：使用多个调节盘调节化学机械抛光装置的系统和方法

公开(公告)号：US20100291840A1

公开(公告)日：2010-11-18

申请号：US12464223

申请日：2009-05-12

申请人： Soon Kang HUANG , Kun-Ku HUNG , Zin-Chang WEI , Chyi Shyuan CHERN

发明人： Soon Kang HUANG , Kun-Ku HUNG , Zin-Chang WEI , Chyi Shyuan CHERN

IPC分类号： B24B1/00 , B24B7/07

CPC分类号： B24B53/003 , B24B53/017

摘要： A chemical mechanical polishing (CMP) apparatus provides for polishing semiconductor wafers and for conditioning the polishing pad of the CMP apparatus using multiple conditioning disks at the same time. The conditioning disks may be moved together or independently along the surface of polishing pad to condition the entire surface of the rotating polishing pad.

摘要翻译： 化学机械抛光（CMP）装置提供用于抛光半导体晶片并且同时使用多个调节盘来调节CMP设备的抛光垫。调理盘可以沿着抛光垫的表面一起移动或独立地移动，以调节旋转抛光垫的整个表面。