公开(公告)号：US20240040294A1

公开(公告)日：2024-02-01

申请号：US18266066

申请日：2021-12-16

Applicant: Sorama Holding B.V.

Inventor： Rick Scholte ,  Ivo Jansen

IPC: H04R1/08 ,  H04R9/02 ,  H04N23/51 ,  H04N23/63

CPC classification number: H04R1/08 ,  H04R9/022 ,  H04N23/51 ,  H04N23/632 ,  H04R2201/40 ,  H04R2499/11

Abstract: Improved passive heat sinking of acoustic cameras having a microphone array and onboard processor is provided. The onboard processor is heat sunk using a heat sink member within a sealed enclosure to conduct heat to a heat dissipation surface of the enclosure. Preferably the heat sink member is mostly a spring member having the dual functions of providing mechanical force to ensure good thermal contact with the onboard processor and providing heat conduction to the heat dissipation surface. A single enclosure can enclose both the onboard processor and the microphone array. Alternatively, the enclosure can have two parts, a first part enclosing the microphone array, and a second part enclosing the onboard processor.