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    Antenna modules in phased array antennas
    1.
    发明授权
    Antenna modules in phased array antennas 有权

    公开(公告)号：US12166282B2

    公开(公告)日：2024-12-10

    申请号：US18216415

    申请日：2023-06-29

    Applicant: Space Exploration Technologies Corp.

    Inventor： Javier Rodriguez De Luis ,  Nil Apaydin ,  Ersin Yetisir ,  Alireza Mahanfar ,  Siamak Ebadi

    IPC: H01Q1/38 ,  H01Q3/26 ,  H01Q21/00

    Abstract: An apparatus includes a plurality of conductive structures having first sides and second sides opposite the first sides, wherein the second sides of the plurality of conductive structures are configured to be physically coupleable with a printed circuit board (PCB) of a receiver, a transmitter, or a transceiver. The first sides of the plurality of conductive structures are configured to be spaced from the PCB by a first distance when the plurality of conductive structures is physically coupled with the PCB. The apparatus includes an antenna having a first side and a second side opposite the first side. The second side of the antenna is disposed closer to the plurality of conductive structures than the first side of the antenna when the plurality of conductive structures is physically coupled with the PCB.

    HIERARCHICAL NETWORK SIGNAL ROUTING APPARATUS AND METHOD
    3.
    发明申请
    HIERARCHICAL NETWORK SIGNAL ROUTING APPARATUS AND METHOD 审中-公开

    公开(公告)号：US20190252755A1

    公开(公告)日：2019-08-15

    申请号：US16276360

    申请日：2019-02-14

    Applicant: Space Exploration Technologies Corp.

    Inventor： Souren Shamsinejad ,  Javier Rodriguez De Luis ,  Nil Apaydin ,  Alireza Mahanfar

    IPC: H01P5/19

    CPC classification number: H01P5/19

    Abstract: In embodiments, a power splitter/combiner includes a first electrically conductive trace included in a first layer; second and third electrically conductive traces included in a second layer; a first via electrically coupled to the first and second electrically conductive traces; and a second via electrically coupled to the first and third electrically conductive traces. A first portion of the first electrically conductive trace comprises a first port of the power splitter/combiner. A second portion of the first electrically conductive trace, the first via, and the second electrically conductive trace comprises a second port of the power splitter/combiner. A third portion of the first electrically conductive trace, the second via, and the third electrically conductive trace comprises a third port of the power splitter/combiner.

    Signal conditioning modules in phased array antennas
    4.
    发明授权
    Signal conditioning modules in phased array antennas 有权

    公开(公告)号：US12148998B2

    公开(公告)日：2024-11-19

    申请号：US17993606

    申请日：2022-11-23

    Applicant: Space Exploration Technologies Corp.

    Inventor： Trevor Cameron ,  Javier Rodriguez De Luis ,  Nil Apaydin

    IPC: H01Q21/08 ,  H01Q1/38 ,  H01Q1/52 ,  H04B1/16

    Abstract: In some embodiments, a phased array antenna system includes a carrier having a first side and a second side opposite the first side; a first antenna element and a second antenna element coupled to the first side of the carrier, the second antenna element spaced apart from the first antenna element by a space and a signal conditioning module including a support structure having a first side and a second side opposite the first side, one or more signal conditioning elements coupled to the first side of the support structure, and a plurality of coupling elements coupled to the second side of the support structure, wherein at least one of the plurality of coupling elements electrically couples the signal conditioning module to the first antenna element; and at least another of the plurality of coupling elements electrically couples the signal conditioning module to the carrier.

    ANTENNA MODULES IN PHASED ARRAY ANTENNAS
    5.
    发明公开
    ANTENNA MODULES IN PHASED ARRAY ANTENNAS 审中-公开

    公开(公告)号：US20230344147A1

    公开(公告)日：2023-10-26

    申请号：US18216415

    申请日：2023-06-29

    Applicant: Space Exploration Technologies Corp.

    Inventor： Javier Rodriguez De Luis ,  Nil Apaydin ,  Ersin Yetisir ,  Alireza Mahanfar ,  Siamak Ebadi

    IPC: H01Q21/00 ,  H01Q1/38 ,  H01Q3/26

    CPC classification number: H01Q21/0087 ,  H01Q1/38 ,  H01Q3/26 ,  H01Q21/0025

    Abstract: An apparatus includes a plurality of conductive structures having first sides and second sides opposite the first sides, wherein the second sides of the plurality of conductive structures are configured to be physically coupleable with a printed circuit board (PCB) of a receiver, a transmitter, or a transceiver. The first sides of the plurality of conductive structures are configured to be spaced from the PCB by a first distance when the plurality of conductive structures is physically coupled with the PCB. The apparatus includes an antenna having a first side and a second side opposite the first side. The second side of the antenna is disposed closer to the plurality of conductive structures than the first side of the antenna when the plurality of conductive structures is physically coupled with the PCB.

    CROSS-COUPLING MODELING AND COMPENSATION FOR ANTENNA APPARATUS
    7.
    发明申请
    CROSS-COUPLING MODELING AND COMPENSATION FOR ANTENNA APPARATUS 有权

    公开(公告)号：US20230134123A1

    公开(公告)日：2023-05-04

    申请号：US18091995

    申请日：2022-12-30

    Applicant: Space Exploration Technologies Corp.

    Inventor： Eric Pepin ,  Kim W. Schulze ,  Ersin Yetisir ,  Javier Rodriguez De Luis

    IPC: H01Q3/30

    Abstract: Systems, methods, and non-transitory media are provided for cross-coupling modeling and compensation. An example method can include determining one or more cross-coupling coefficients representing electrical cross-coupling between a first signal path through a component and a second signal path through the component; based on the one or more cross-coupling coefficients, determining a first modified beamforming weight for a first signal associated with the first signal path through the component and a second modified beamforming weight for a second signal associated with the second signal path through the component, wherein the first and second modified beamforming weights compensate for the electrical cross-coupling between the first signal path through the component and the second signal path through the component; applying the first modified beamforming weight to the first signal associated with the first signal path; and applying the second modified beamforming weight to the second signal associated with the second signal path.

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