公开(公告)号：US20210005550A1

公开(公告)日：2021-01-07

申请号：US16502025

申请日：2019-07-03

申请人： Sri Chaitra Jyotsna CHAVALI ,  Tarek IBRAHIM ,  Wei-Lun JEN

发明人： Sri Chaitra Jyotsna CHAVALI ,  Tarek IBRAHIM ,  Wei-Lun JEN

IPC分类号： H01L23/522 ,  H01L21/768 ,  H01L23/48 ,  H01L49/02 ,  H05K1/18

摘要： Embodiments herein describe techniques for a semiconductor device including a package substrate having a core layer. An inductor may include a first coaxial line and a second coaxial line vertically through the core layer, and an interconnect within the package substrate coupling the first coaxial line and the second coaxial line. A first magnetic segment may surround the first coaxial line within the core layer, and a second magnetic segment may surround the second coaxial line within the core layer. In addition, a third magnetic segment may surround the interconnect and be coupled to the first magnetic segment and the second magnetic segment. Other embodiments may be described and/or claimed.