公开(公告)号：US07354203B2

公开(公告)日：2008-04-08

申请号：US11178624

申请日：2005-07-11

申请人： Stefan Pfnuer ,  Tengda Du ,  Kevin Zhang ,  Julie S. Eng ,  Axel Mehnert

发明人： Stefan Pfnuer ,  Tengda Du ,  Kevin Zhang ,  Julie S. Eng ,  Axel Mehnert

IPC分类号： G02B6/36

CPC分类号： G02B6/4201 ,  G02B6/36 ,  G02B6/4251

摘要： A package for maintaining alignment of components includes a frame and a beam with the beam attached to the frame and one end of the beam. One or more components are mounted to the beam. The frame and a portion of the beam are separated from each other by a channel which allows portions of the beam to flex substantially independently of the frame when a force is applied to the frame. Thus, the effects resulting from forces applied to the frame are not experienced by the beam, or are at least attenuated, so that the alignment of the components mounted on the beam is substantially preserved.

摘要翻译： 用于维持部件对准的包装件包括框架和梁，其中梁连接到框架和梁的一端。 一个或多个部件安装到梁上。 框架和梁的一部分通过通道分开，该通道允许当力施加到框架时梁的一部分基本上独立于框架弯曲。 因此，由施加到框架的力产生的影响不受梁的影响，或者至少被衰减，使得安装在梁上的部件的对准被基本保持。

公开(公告)号：US06248604B1

公开(公告)日：2001-06-19

申请号：US09395934

申请日：1999-09-14

申请人： Julie S. Eng ,  Joseph Michael Freund ,  George John Przybylek ,  Dennis Mark Romero ,  Arthur Mike Sergent

发明人： Julie S. Eng ,  Joseph Michael Freund ,  George John Przybylek ,  Dennis Mark Romero ,  Arthur Mike Sergent

IPC分类号： G02R3126

CPC分类号： H01S5/0014

摘要： A method for testing semiconductor laser devices is described. The method includes testing a monolithically integrated semiconductor laser device via electrical contact testing and/or far field testing. These tests will provide the total performance of the entire device. Further, the method includes accurate cleaving off of a portion of the laser device and re-testing to determine the relative performance of the remainder of the device. Through comparison of the test and re-test results, it is possible to reduce the design cycle for monolithically integrated semiconductor laser devices by detecting design flaws and imperfections or by ascertaining a more advantageous design.

摘要翻译： 对半导体激光器件的测试方法进行了说明。 该方法包括通过电接触测试和/或远场测试来测试单片集成半导体激光器件。 这些测试将提供整个设备的总体性能。 此外，该方法包括精确地分离激光器件的一部分并重新测试以确定器件的其余部分的相对性能。 通过比较测试和重新测试结果，可以通过检测设计缺陷和缺陷或通过确定更有利的设计来减少单片集成半导体激光器件的设计周期。