Metal-contact induced crystallization in semiconductor devices
    1.
    发明授权
    Metal-contact induced crystallization in semiconductor devices 有权
    金属接触引起的半导体器件结晶

    公开(公告)号:US06277714B1

    公开(公告)日:2001-08-21

    申请号:US09400496

    申请日:1999-09-21

    IPC分类号: H01L2120

    摘要: The method of the invention induces crystallization in an amorphous semiconductor layer, and includes the steps of: a) producing a patterned metal layer on a first substrate, the metal layer exhibiting a weak level of adherence to the first substrate; b) pressing the metal layer into physical contact with the amorphous semiconductor layer; c) applying heat, light or both to the metal layer and amorphous semiconductor layer to cause a reaction therebetween and a crystallization of the amorphous semiconductor that is juxtaposed to the metal.

    摘要翻译: 本发明的方法在非晶半导体层中诱导结晶,并且包括以下步骤:a)在第一衬底上产生图案化金属层,所述金属层对第一衬底表现出弱的粘着水平; b)将所述金属层按压与所述非晶半导体层物理接触; c)向金属层和非晶半导体层施加热,光或两者,以引起其间的反应和与金属并置的非晶半导体的结晶。