公开(公告)号：US20080067652A1

公开(公告)日：2008-03-20

申请号：US11532676

申请日：2006-09-18

Applicant: Stephane MENARD ,  Jun LU

Inventor： Stephane MENARD ,  Jun LU

IPC: H01L23/02

CPC classification number: B81C1/00269 ,  B81C2203/019

Abstract: A micro-electromechanical systems (MEMS) package that includes a substrate onto which is disposed or otherwise formed an active MEMS device, a first barrier wall for preventing sealant from contaminating the MEMS device, a second barrier wall for preventing sealant from contaminating unintended areas of the substrate, and a cap for hermetically sealing the MEMS package with a particular gas or mixtures thereof which enhance the MEMS performance.

Abstract translation: 一种微机电系统（MEMS）封装，其包括其上设置或以其他方式形成有源MEMS器件的基板，用于防止密封剂污染MEMS器件的第一阻挡壁，用于防止密封剂污染非预期区域的第二阻挡壁 衬底和用于用增强MEMS性能的特定气体或其混合物气密密封MEMS封装的盖。