公开(公告)号：US06255266B1

公开(公告)日：2001-07-03

申请号：US09659728

申请日：2000-09-11

申请人： Subhash Gupta ,  Simon Choo I ,  Mei Sheng Zhou ,  Paul Ho

发明人： Subhash Gupta ,  Simon Choo I ,  Mei Sheng Zhou ,  Paul Ho

IPC分类号： C11D904

CPC分类号： C11D3/2072 ,  C11D3/2003 ,  C11D3/2093 ,  C11D3/3945 ,  C23G5/032 ,  Y10S134/902

摘要： A method of cleaning elemental copper, cobalt, or nickel from the surface of equipment hardware without corroding or damaging the equipment parts and surfaces in the event of wafer breakage and non-wafer breakage is described. A solution comprising an alkyldione peroxide, a stabilizing agent, and alcohols is used to oxidize the metal and form soluble complexes which are removed by the cleaning solution. Also, a novel alkyldione peroxide solution for cleaning elemental copper, cobalt, or nickel from the surface of equipment hardware in the event of wafer breakage and non-wafer breakage is provided.

摘要翻译： 描述了从设备硬件表面清除元素铜，钴或镍的方法，而不会在晶片断裂和非晶片断裂的情况下腐蚀或损坏设备部件和表面。 使用包含烷基二酮过氧化物，稳定剂和醇的溶液来氧化金属并形成被清洁溶液除去的可溶性络合物。 此外，提供了在晶片断裂和非晶片断裂的情况下从设备硬件的表面清除元素铜，钴或镍的新型烷基二氧化物溶液。