公开(公告)号：US06726545B2

公开(公告)日：2004-04-27

申请号：US10134821

申请日：2002-04-26

申请人： Subramanian Balakumar ,  Chen Feng ,  Victor Lim ,  Paul Proctor ,  Mukhopadhyay Madhusudan ,  Chivukula Subrahmanyam ,  Yelehanka Ramachandramurthy Pradeep

发明人： Subramanian Balakumar ,  Chen Feng ,  Victor Lim ,  Paul Proctor ,  Mukhopadhyay Madhusudan ,  Chivukula Subrahmanyam ,  Yelehanka Ramachandramurthy Pradeep

IPC分类号： B24B100

CPC分类号： B24B37/16 ,  B24B21/10 ,  B24B37/245

摘要： A linear polishing apparatus for polishing a semiconductor substrate including a novel polishing belt arrangement with at least two polishing belts forming a continuous loop. Each belt having an outside polishing surface and an inside smooth surface. The belts are spaced alongside each other sharing a common axis at each end. The belts are looped around a pair of rollers making up a driver roller at one end and a driven roller at the other end. A platen member interposes each belt and is placed between the pairs of rollers. The platen provides a polishing plane and supporting surface for the polishing belts. The polishing plane includes a plurality of holes communicating with an elongated plenum chamber underlying the plane. The chamber supplies a compressed gas to impart an upward pressure against the polishing belts. The driver rollers are coupled to separate motors to independently drive and control at least said two of the polishing belts.

摘要翻译： 一种用于抛光包括具有形成连续环的至少两个抛光带的新型抛光带装置的半导体衬底的线性抛光装置。 每个带具有外部抛光表面和内部光滑表面。 皮带沿着彼此间隔开，在每一端共享公共轴线。 皮带环绕一对辊组成一端的驱动辊和另一端的从动辊。 压板构件插入每个带并且放置在成对的辊之间。 压板提供抛光平面和抛光带的支撑表面。 抛光平面包括与平面下方的细长的增压室连通的多个孔。 该室供应压缩气体以向抛光带施加向上的压力。 驱动辊连接到单独的马达以独立地驱动和控制至少所述两个抛光带。