公开(公告)号：US20230068160A1

公开(公告)日：2023-03-02

申请号：US17742414

申请日：2022-05-12

Applicant: Subtron Technology Co., Ltd.

Inventor： Shaw-Wen Lao ,  Chih-Peng Fan ,  Ping-I Cheng

IPC: H01L23/498 ,  H01L25/065 ,  H01L23/538

Abstract: A package carrier including a multi-layer circuit substrate and a silicon wafer is provided. The multi-layer circuit substrate has a first opening and a second opening communicating with each other. A first diameter and a first depth of the first opening are respectively greater than a second diameter and a second depth of the second opening. The silicon wafer is embedded in the first opening of the multi-layer circuit substrate. The silicon wafer has an active surface and includes a connecting circuit layer. The connecting circuit layer is disposed on the active surface and electrically connected to the multi-layer circuit substrate. The second opening of the multi-layer circuit substrate exposes part of the connecting circuit layer.