公开(公告)号：US5057457A

公开(公告)日：1991-10-15

申请号：US580542

申请日：1990-09-11

申请人： Syouichi Miyahara ,  Keiji Kamasaki ,  Michiya Higashi

发明人： Syouichi Miyahara ,  Keiji Kamasaki ,  Michiya Higashi

IPC分类号： H01L21/56 ,  H01L23/29 ,  H01L23/31 ,  H01L25/065

CPC分类号： H01L23/293 ,  H01L21/56 ,  H01L23/3135 ,  H01L25/0652 ,  H01L2224/48247 ,  H01L2224/8592 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/181

摘要： In multimold semiconductor devices, semiconductor chips are mounted on a lead frame and bonded with wire, sealed by an inner resin, and further enclosed by an outer resin. In particular, wax to be added to the inner resin is at least one compound selected from the group consisting of ester group, fatty acid based, fatty acid metallic salt based, fatty alcohol, polyhydric alcohol, and fatty acid amide compounds. In the semiconductor devices sealed by the inner resin including wax thus defined, since the adhesion strength between the inner and outer resins can be increased, peeling resistance between the two and the moisture resistance can be improved markedly and cracks after dip soldering can be perfectly eliminated, without effecting any conventional inner resin treatment such as honing, burning, after-curing, etc.