公开(公告)号：US20180358951A1

公开(公告)日：2018-12-13

申请号：US15985949

申请日：2018-05-22

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Satoru OHKUBO ,  Kazuyuki IMAGAWA ,  Ryo MIYAMOTO

IPC: H03H9/64

Abstract: An acoustic wave device includes: a first substrate having a first surface on which an acoustic wave element is located; a second substrate having a second surface on which a functional element is located; a third substrate having a third surface, which faces the first and second surfaces, and a fourth surface being opposite to the third surface, a first metal layer separated from the acoustic wave element and a wiring line in the first substrate and connecting the first and third surfaces; a second metal layer separated from the functional element and a wiring line in the second substrate and connecting the second and third surfaces; a first metal pattern located on the third surface, being in contact with the first and second metal layers, and connecting the first and second metal layers; and a terminal located on the fourth surface and electrically connectable to the first metal pattern.