-
1.
公开(公告)号:US20200350273A1
公开(公告)日:2020-11-05
申请号:US16869694
申请日:2020-05-08
Applicant: Tanaka Denshi Kogyo K.K.
Inventor: Yuki ANTOKU , Shota KAWANO , Yusuke SAKITA
IPC: H01L23/00 , H01L23/495 , H01L23/31 , H01L25/065 , H01L25/00
Abstract: A gold-coated silver bonding wire includes: a core material containing silver as a main component; and a coating layer provided on a surface of the core material and containing gold as a main component. The gold-coated silver bonding wire contains gold in a range of not less than 2 mass % nor more than 7 mass %, and at least one sulfur group element selected from the group consisting of sulfur, selenium, and tellurium in a range of not less than 1 mass ppm nor more than 80 mass ppm, with respect to a total content of the bonding wire.
-
公开(公告)号:US20210050321A1
公开(公告)日:2021-02-18
申请号:US16969357
申请日:2018-04-19
Applicant: TANAKA DENSHI KOGYO K.K.
Inventor: Jun CHIBA , Yuki ANTOKU , Shota KAWANO
IPC: H01L23/00
Abstract: A noble metal-coated silver bonding wire suppresses corrosion at the bonding interface under severe conditions of high temperature and high humidity, and the noble metal-coated silver bonding wire can be ball-bonded in the air. The noble metal-coated silver wire for ball bonding is a noble metal-coated silver wire including a noble metal coating layer on a core material made of pure silver or a silver alloy, wherein the wire contains at least one sulfur group element, the noble metal coating layer includes a palladium intermediate layer and a gold skin layer, the palladium content relative to the entire wire is 0.01 mass % or more and 5.0 mass % or less, the gold content relative to the entire wire is 1.0 mass % or more and 6.0 mass % or less, and the sulfur group element content relative to the entire wire is 0.1 mass ppm or more and 100 mass ppm or less.
-