公开(公告)号：US12068416B2

公开(公告)日：2024-08-20

申请号：US17261015

申请日：2020-12-29

Applicant: TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.

Inventor： Xiaobo Hu

IPC: H01L29/786 ,  H01L29/417 ,  H01L29/66

CPC classification number: H01L29/7869 ,  H01L29/41733 ,  H01L29/66742

Abstract: A thin film transistor and a manufacturing method thereof are provided. The thin film transistor includes a composite electrode including a barrier layer and an electrode layer. The barrier layer has a protruding part relative to the electrode layer, an orthographic projection of the protruding part on the composite electrode protrudes beyond an orthographic projection of the electrode layer on the composite electrode, and a length of the protruding part ranges from 0.3 um to 0.5 um. The thin film transistor and the manufacturing method thereof of the present disclosure can relieve light leakage, thereby improving a contrast ratio of products.

公开(公告)号：US11367777B2

公开(公告)日：2022-06-21

申请号：US16627811

申请日：2019-12-24

Applicant: TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.

Inventor： Xiaobo Hu

IPC: H01L29/49 ,  H01L27/12 ,  H01L29/40 ,  H01L29/66

Abstract: The present disclosure provides a display panel, which includes a base substrate and an array layer disposed on the base substrate. The array layer includes a gate layer disposed on the base substrate; and the gate layer includes a first conductive metal layer, and a first molybdenum alloy layer and a first molybdenum oxide alloy layer sequentially stacked on the first conductive metal layer.

公开(公告)号：US11271021B2

公开(公告)日：2022-03-08

申请号：US16954575

申请日：2020-05-12

Applicant: TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.

Inventor： Xin Zhang ,  Xiaobo Hu

IPC: H01L33/00 ,  H01L33/62 ,  H01L27/12 ,  H01L25/075

Abstract: An array substrate, a fabrication method thereof, and a display device are provided. The fabrication method includes forming a first conductive layer and a second conductive layer on both of a first area and a second area of a substrate; forming a bonding pin in the first area to electrically connect with a driving chip, wherein the second conductive layer is located at a side of the first conductive layer away from the substrate; and removing the second conductive layer in the second area, forming a conductive electrode in the second area to electrically connect with a light-emitting element by a connection member.