公开(公告)号：US11357110B2

公开(公告)日：2022-06-07

申请号：US17132626

申请日：2020-12-23

Applicant: TDK Corporation

Inventor： Takeshi Oohashi ,  Shinichiro Toda ,  Daiki Kusunoki ,  Takashi Ohtsuka ,  Kazuhiro Yoshikawa ,  Kenichi Yoshida

IPC: H05K1/16 ,  H01G4/228 ,  H01G4/33 ,  H01G4/40 ,  H01L49/02

Abstract: Disclosed herein is an electronic component that includes a first conductive layer including a lower electrode and a first inductor pattern, a dielectric film that covers the lower electrode, an upper electrode laminated on the lower electrode through the dielectric film, an insulating layer that covers the first conductive layer, dielectric film, and upper electrode, and a second conductive layer formed on the insulating layer and including a second inductor pattern. The first and second inductor patterns are connected in parallel through via conductors penetrating the insulating layer.