公开(公告)号：US20230237285A1

公开(公告)日：2023-07-27

申请号：US18130452

申请日：2023-04-04

Applicant: TDK CORPORATION

Inventor： Gaku ECHIGOYA ,  Hiroshi SATOU ,  Keijiro ISHIDA ,  Hajime KUDO

IPC: G06K1/12 ,  H01G4/002

CPC classification number: G06K1/12 ,  H01G4/002 ,  G06K19/06037

Abstract: In a method of manufacturing a multilayer chip component according to an aspect of the present disclosure, laser processing is used for forming dots of a two-dimensional code. This laser processing is laser processing with respect to a laminate substrate in a state before baking is performed, and an impact at the time of processing is absorbed to a certain degree due to elastic deformation of the laminate substrate. For this reason, according to the manufacturing method, occurrence of cracking can be curbed compared to laser processing with respect to an element body in a state after baking is performed.

公开(公告)号：US20210248327A1

公开(公告)日：2021-08-12

申请号：US17166052

申请日：2021-02-03

Applicant: TDK CORPORATION

Inventor： Gaku ECHIGOYA ,  Hiroshi SATOU ,  Keijiro ISHIDA ,  Hajime KUDO

IPC: G06K1/12 ,  H01G4/002

Abstract: In a method of manufacturing a multilayer chip component according to an aspect of the present disclosure, laser processing is used for forming dots of a two-dimensional code. This laser processing is laser processing with respect to a laminate substrate in a state before baking is performed, and an impact at the time of processing is absorbed to a certain degree due to elastic deformation of the laminate substrate. For this reason, according to the manufacturing method, occurrence of cracking can be curbed compared to laser processing with respect to an element body in a state after baking is performed.

公开(公告)号：US20210248435A1

公开(公告)日：2021-08-12

申请号：US17166074

申请日：2021-02-03

Applicant: TDK CORPORATION

Inventor： Gaku ECHIGOYA ,  Hiroshi SATOU ,  Keijiro ISHIDA ,  Hajime KUDO

IPC: G06K19/06 ,  H01G4/30 ,  H01G4/002 ,  H01F41/12

Abstract: In a method of manufacturing a multilayer chip component according to an aspect of the present disclosure, a two-dimensional code is formed in each of green chips divided in a dividing step. In the two-dimensional code, a substrate ID identifying a laminate substrate and an individual body ID identifying an individual multilayer chip component are associated with each other. Therefore, it is possible to accurately and quickly discern which laminate substrate a multilayer chip component is manufactured from by reading the two-dimensional code of the multilayer chip component, and thus high traceability can be achieved.

公开(公告)号：US20250022649A1

公开(公告)日：2025-01-16

申请号：US18768491

申请日：2024-07-10

Applicant: TDK Corporation

Inventor： Noriyuki SAITO ,  Tomoaki KAWADA ,  Shigemitsu TOMAKI ,  Misaki TABATA ,  Riku TAKEDA ,  Hiroshi SATOU ,  Gaku ECHIGOYA

IPC: H01F27/28

Abstract: A coil component includes an element body, and a first coil conductor and a second coil conductor disposed in the element body, in which the conductor has, in a cross section orthogonal to an extending direction of the first coil conductor and the second coil conductor, a first end portion and a second end portion in a width direction viewed from the extending direction, the first end portion forms a first angle, the second end portion forms a second angle, and the first angle and the second angle are different.

公开(公告)号：US20210248437A1

公开(公告)日：2021-08-12

申请号：US17167694

申请日：2021-02-04

Applicant: TDK CORPORATION

Inventor： Gaku ECHIGOYA ,  Hiroshi SATOU ,  Keijiro ISHIDA ,  Hajime KUDO

IPC: G06K19/06 ,  H01G2/24 ,  H01F27/02

Abstract: In a multilayer chip component according to an aspect of the present disclosure, dots of a two-dimensional code provided on a main surface of an element body has a semicircular cross-sectional shape. That is, since substantially no corner portions are present in a cross-sectional shape of the dots, stress is unlikely to remain when the dots are formed, and stress is unlikely to be concentrated after the dots are formed. Therefore, cracking is unlikely to occur in the foregoing multilayer chip component.