公开(公告)号：US20230253830A1

公开(公告)日：2023-08-10

申请号：US18164723

申请日：2023-02-06

Applicant: TDK Corporation

Inventor： Takuya YOSHIDA ,  Noritaka CHIYO ,  Michihisa TOKUI ,  Kentaro KAMIYAMA ,  Daiki YAMANE

IPC: H02J50/12 ,  H01F17/00

CPC classification number: H02J50/12 ,  H01F17/0006 ,  H01F2017/0073

Abstract: Disclosed herein is a coil component that includes a substrate, and a planar spiral coil pattern provided on the surface of the substrate. The coil pattern has a circularity higher in its inner shape than in its outer shape.

公开(公告)号：US20220352752A1

公开(公告)日：2022-11-03

申请号：US17722744

申请日：2022-04-18

Applicant: TDK Corporation

Inventor： Noritaka CHIYO ,  Michihisa TOKUI ,  Takuya YOSHIDA

IPC: H02J50/00 ,  H02J50/12 ,  H01F27/28

Abstract: Disclosed herein is a coil module that includes a holder having a flat-plate part for placing thereon a target device, a first stopper extending in a first direction along a first side of the flat-plate part, and a second stopper extending in a second direction orthogonal to the first direction along a second side of the flat-plate part; and a coil provided so as to overlap the flat-plate part of the holder. As viewed in a coil axis direction, an outer size of the coil in a third direction inclined at a predetermined angle with respect to the first direction is larger than an outer size of the coil in a fourth direction orthogonal to the third direction.

公开(公告)号：US20230307963A1

公开(公告)日：2023-09-28

申请号：US18173308

申请日：2023-02-23

Applicant: TDK Corporation

Inventor： Takuya YOSHIDA ,  Michihisa TOKUI ,  Noritaka CHIYO

IPC: H02J50/70 ,  H01F27/33 ,  H01F27/36

CPC classification number: H02J50/70 ,  H01F27/33 ,  H01F27/36 ,  H02J50/10

Abstract: Disclosed herein is a noise suppression sheet that includes a substrate having a first through hole, and a conductor pattern provided on one surface of the substrate. The conductor pattern has a plurality of linear patterns extending in a first direction and a connection pattern connecting the plurality of linear patterns. The one surface of the substrate has a clearance area surrounded by the plurality of linear patterns and having no conductor pattern. The size of the clearance area in a second direction different from the first direction is larger than an arrangement pitch between the plurality of linear patterns in the second direction. The first through hole is formed in the clearance area.

公开(公告)号：US20250167592A1

公开(公告)日：2025-05-22

申请号：US18951803

申请日：2024-11-19

Applicant: TDK Corporation

Inventor： Michihisa TOKUI ,  Kentaro KAMIYAMA ,  Sumin Kumar CHALISE

IPC: H02J50/10 ,  H01F27/30

Abstract: Disclosed herein is a coil component that includes a first magnetic body, a first coil disposed so as to overlap the first magnetic body, a second coil having an outer size smaller than an outer size of the first coil and disposed so as to overlap the first coil, and a second magnetic body having an outer size smaller than the outer size of the first coil and disposed between the first and second coils.

公开(公告)号：US20220247453A1

公开(公告)日：2022-08-04

申请号：US17575223

申请日：2022-01-13

Applicant: TDK Corporation

Inventor： Noritaka CHIYO ,  Takuya YOSHIDA ,  Michihisa TOKUI ,  Tomohiro MORIKI ,  Takahiro OHISHI

IPC: H04B5/00 ,  H02J50/12

Abstract: Disclosed herein is a coil component that includes a first coil pattern, wherein an opening area surrounded by the first coil pattern has a first side extending in a first direction and a second side extending in the first direction, and wherein the first side is longer than the second side.