公开(公告)号：US10925150B2

公开(公告)日：2021-02-16

申请号：US16514250

申请日：2019-07-17

Applicant: TE CONNECTIVITY CORPORATION

Inventor： Bin Lin ,  Bernard Wilhelm Vetten ,  Eric DiBiaso

IPC: H05K1/02

Abstract: A printed circuit board includes a substrate having a plurality of stacked circuit board layers. The substrate has a top surface and a bottom surface. The printed circuit board includes a signal contact on the substrate. The signal contact has a signal via and a signal trace extending from the signal via. The signal via extends between the top surface and the bottom surface along a via axis. The printed circuit board includes an anti-pad around the signal via extending through the substrate along the via axis. The anti-pad extends between the top surface and the bottom surface. The anti-pad has a first width at the top surface and the lower anti-pad has a second width at the bottom surface different than the first width.

公开(公告)号：US20210022240A1

公开(公告)日：2021-01-21

申请号：US16514250

申请日：2019-07-17

Applicant: TE CONNECTIVITY CORPORATION

Inventor： Bin Lin ,  Bernard Wilhelm Vetten ,  Eric DiBiaso

IPC: H05K1/02

Abstract: A printed circuit board includes a substrate having a plurality of stacked circuit board layers. The substrate has a top surface and a bottom surface. The printed circuit board includes a signal contact on the substrate. The signal contact has a signal via and a signal trace extending from the signal via. The signal via extends between the top surface and the bottom surface along a via axis. The printed circuit board includes an anti-pad around the signal via extending through the substrate along the via axis. The anti-pad extends between the top surface and the bottom surface. The anti-pad has a first width at the top surface and the lower anti-pad has a second width at the bottom surface different than the first width.