公开(公告)号：US20220056312A1

公开(公告)日：2022-02-24

申请号：US17404258

申请日：2021-08-17

Applicant: TESA SE

Inventor： Franziska Czerwonatis ,  Axel Burmeister ,  Ingo Neubert ,  Anna Blazejewski ,  Jessica Bulda

IPC: C09J7/25 ,  C09J7/38 ,  C09J7/26 ,  C09J5/00 ,  B05D5/10 ,  B05D1/26

Abstract: The present invention relates to an adhesive tape of thickness 40 to 300 μm that can be redetached without residue or destruction by stretching essentially in the plane of the bond, comprising at least one carrier of thickness 10 to 150 μm comprising at least one layer based on preferably uncrosslinked thermoplastic polyurethane that has typically been produced by means of extrusion and has a Shore A hardness of not more than 87, where the carrier has a ratio of force at 400% elongation F400% to breaking force Fbreak of not more than 45%, and on which a pressure-sensitive adhesive layer is disposed on at least one side, and wherein the adhesive tape has a ratio of stripping force Fstrip to breaking force Fbreak of less than 60%. The invention also relates to an adhesive tape of thickness 40 to 300 μm that can be redetached without residue or destruction by stretching essentially in the plane of the bond, comprising at least one carrier of thickness 10 to 150 μm comprising at least one layer based on preferably uncrosslinked polyurethane that has been produced from a dispersion and has a modulus at 100% elongation of not more than 1.8 MPa, where the carrier has a ratio of force at 400% elongation F400% to breaking force Fbreak of not more than 30%, and on which a pressure-sensitive adhesive layer is disposed on at least one side, and wherein the adhesive tape has a ratio of stripping force Fstrip to breaking force Fbreak of less than 60%. The invention also relates to a process for producing the adhesive tapes and to the use thereof for bonding of components in electronic devices.