公开(公告)号：US20210210473A1

公开(公告)日：2021-07-08

申请号：US17136413

申请日：2020-12-29

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： BAHER HAROUN ,  TOBIAS BERNHARD FRITZ ,  MICHAEL SZELONG ,  ERNST MUELLNER

IPC: H01L25/16 ,  H01L41/113 ,  H01L27/20 ,  H01L49/02 ,  H01L23/31 ,  G01L1/18

Abstract: An integrated circuit is described herein that includes a semiconductor substrate. First and second piezoresistive sensors are on or in the substrate where each have a respective sensing axis extending in first and second directions respectively parallel with a surface of the substrate, where the second direction is perpendicular to the first direction. A third piezoresistive sensor is on or in the substrate and has a respective sensing axis extending in a third direction parallel with the surface of the substrate and neither parallel nor perpendicular to the first and second directions.