公开(公告)号：US20250140620A1

公开(公告)日：2025-05-01

申请号：US18498679

申请日：2023-10-31

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Thomas KRONENBERG ,  Mohammad WASEEM HUSSAIN

IPC: H01L23/31 ,  H01L21/56 ,  H01L21/683 ,  H01L23/00

Abstract: In examples, a method for manufacturing a package comprises depositing a metal contact layer on a surface of a wafer, the wafer including first and second diodes; positioning the wafer on an expandable tape coupled to a carrier; dicing the wafer to produce first and second dies, the first die including the first diode and the second die including the second diode; wire bonding the first die to the second die using a bond wire; covering the first and second dies and the bond wire with a mold compound to produce a molded structure; decoupling the molded structure from the expandable tape; and sawing the molded structure to produce the package.