公开(公告)号：US20210320074A1

公开(公告)日：2021-10-14

申请号：US17356302

申请日：2021-06-23

申请人： TEXAS INSTRUMENTS INCORPORATED

发明人： Rafael Jose Lizares Guevara ,  Aniceto Tabangcura Rabilas, JR. ,  Ray Fredric Solis de Asis ,  Sylvester Tigno Sanchez ,  Alvin Lopez Andaya

IPC分类号： H01L23/00 ,  H01L21/56 ,  H01L23/495

摘要： In some examples, a package comprises a semiconductor die and a bond pad formed upon the semiconductor die. The bond pad has a protrusion on a top surface of the bond pad. The package also comprises a metal contact and a bond wire coupled to the protrusion and to the metal contact.

公开(公告)号：US11600583B2

公开(公告)日：2023-03-07

申请号：US17356302

申请日：2021-06-23

申请人： TEXAS INSTRUMENTS INCORPORATED

发明人： Rafael Jose Lizares Guevara ,  Aniceto Tabangcura Rabilas, Jr. ,  Ray Fredric Solis de Asis ,  Sylvester Tigno Sanchez ,  Alvin Lopez Andaya

IPC分类号： H01L23/00 ,  H01L21/56 ,  H01L23/495

摘要： In some examples, a package comprises a semiconductor die and a bond pad formed upon the semiconductor die. The bond pad has a protrusion on a top surface of the bond pad. The package also comprises a metal contact and a bond wire coupled to the protrusion and to the metal contact.

公开(公告)号：US11081456B2

公开(公告)日：2021-08-03

申请号：US16554025

申请日：2019-08-28

申请人： TEXAS INSTRUMENTS INCORPORATED

发明人： Rafael Jose Lizares Guevara ,  Aniceto Tabangcura Rabilas, Jr. ,  Ray Fredric Solis de Asis ,  Sylvester Tigno Sanchez ,  Alvin Lopez Andaya

IPC分类号： H01L23/00 ,  H01L21/56 ,  H01L23/495

摘要： In some examples, a package comprises a semiconductor die and a bond pad formed upon the semiconductor die. The bond pad has a protrusion on a top surface of the bond pad. The package also comprises a metal contact and a bond wire coupled to the protrusion and to the metal contact.